The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2018
Filed:
Aug. 07, 2015
Applicant:
Analog Devices, Inc., Norwood, MA (US);
Inventor:
Vikram Venkatadri, Malden, MA (US);
Assignee:
Analog Devices, Inc., Norwood, IA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/06 (2013.01); H01L 24/03 (2013.01); H01L 24/81 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/0616 (2013.01); H01L 2224/81203 (2013.01); H01L 2924/351 (2013.01);
Abstract
Integrated circuit dies are provide with a passivation layer having a plurality of differently sized openings exposing bond pads for bonding. The sizes of the bond pads vary in a manner that at least partially compensates for stresses during bonding, such as flip chip thermocompression bonding, due to asymmetric distribution of bond pads.
Venkatadri, Vikram. (2018). Bond pads with differently sized openings (U.S. Patent No. 10074624). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10074624
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile