The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2018
Filed:
Jan. 05, 2017
Fraunhofer-gesellschaft Zur Förderung Der Angewandten Forschung E.v., Munich, DE;
Technische Universität Berlin, Berlin, DE;
Martin Wilke, Berlin, DE;
Kai Zoschke, Berlin, DE;
Markus Wöhrmann, Berlin, DE;
Thomas Fritzsch, Berlin, DE;
Hermann Oppermann, Berlin, DE;
Oswin Ehrmann, Berlin, DE;
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V., Munich, DE;
Technische Universität Berlin, Berlin, DE;
Abstract
A method for manufacturing metal structures for the electrical connection of components comprises the following steps: depositing an auxiliary layer on a substrate; structuring the auxiliary layer in a manner such that the substrate is exposed at least one environment which is envisaged for the metal structures; depositing a galvanic starting layer on the structured auxiliary layer; depositing a lithography layer on the galvanic starting layer and structuring the lithography layer in a manner such that the galvanic starting layer is exposed at least one location envisaged for the metal structure; galvanically depositing the at least one metal structure at the at least one exposed location; removing the structured auxiliary layer. An electronic component is also described.