The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2018
Filed:
Dec. 15, 2015
Applicant:
Stmicroelectronics S.r.l., Agrate Brianza, IT;
Inventor:
Fabio Marchisi, Peschiera Borromeo Milano, IT;
Assignee:
STMICROELECTRONICS S.R.L., Agrate Brianza (MB), IT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/495 (2006.01); H05K 7/18 (2006.01); H01L 21/56 (2006.01); H01L 21/768 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49537 (2013.01); H01L 21/4821 (2013.01); H01L 21/56 (2013.01); H01L 21/76885 (2013.01); H01L 23/3107 (2013.01); H01L 23/3114 (2013.01); H01L 23/4952 (2013.01); H01L 23/49503 (2013.01); H01L 23/49541 (2013.01); H01L 23/49548 (2013.01); H01L 23/49558 (2013.01); H01L 23/49582 (2013.01); H01L 24/49 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/49109 (2013.01); H01L 2224/49111 (2013.01); H01L 2224/49112 (2013.01); H01L 2224/49431 (2013.01); H01L 2224/49433 (2013.01); H01L 2924/00014 (2013.01);
Abstract
An electronic component, such as an integrated circuit, includes at least one circuit having coupled therewith electrical connections including a lead frame of electrically conductive material. The lead frame is produced by an additive process of conductive material, e.g., by 3D printing, by forming a three-dimensional structure of leads having overlapping surfaces with a gap therebetween.
Marchisi, Fabio. (2018). Method of fabricating a lead frame by additive process (U.S. Patent No. 10074596). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10074596
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile