The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 11, 2018

Filed:

Apr. 14, 2016
Applicant:

Hamilton Sundstrand Corporation, Windsor Locks, CT (US);

Inventors:

Raja Kountanya, Vernon, CT (US);

Michael Paul Humbert, Wethersfield, CT (US);

Joseph V. Mantese, Ellington, CT (US);

Matthew E. Lynch, Canton, CT (US);

Daniel V. Viens, Mansfield Center, CT (US);

Assignee:

Hamilton Sundstrand Corporation, Charlotte, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28F 13/18 (2006.01); H01L 23/373 (2006.01); H01L 21/48 (2006.01); H01L 23/42 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3735 (2013.01); H01L 21/4871 (2013.01); H01L 23/3731 (2013.01); H01L 23/3732 (2013.01); H01L 23/3736 (2013.01); H01L 23/3737 (2013.01); H01L 23/42 (2013.01);
Abstract

A multi-layer structure includes a substrate with a surface and with particles partially covering and partially embedded in the surface. The particles have high thermal conductivity and low electrical conductivity. A dielectric layer on the surface partially covers the partially embedded particles. A metal layer on the dielectric layer covering the partially covered particles forms a thermal interface material (TIM) for electronic packaging applications.


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