The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 11, 2018

Filed:

Aug. 31, 2017
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Kazuki Kurokawa, Nagaokakyo, JP;

Hirobumi Adachi, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/30 (2006.01); H01G 4/228 (2006.01); H01G 4/008 (2006.01); H01L 41/083 (2006.01); H01F 27/28 (2006.01); H01G 4/12 (2006.01);
U.S. Cl.
CPC ...
H01G 4/30 (2013.01); H01F 27/2804 (2013.01); H01G 4/0085 (2013.01); H01L 41/083 (2013.01); H01F 2027/2809 (2013.01); H01G 4/1227 (2013.01);
Abstract

A ceramic electronic component includes a laminated body including ceramic layers and conductor layers stacked alternately; and first and second external electrodes provided on portions of the laminated body. Each of the first and second external electrodes includes a sintered metal layer provided on the laminated body, a conductive resin layer covering the sintered metal layer, and a plated layer covering the conductive resin layer. The maximum length of the sintered metal layer provided on the second principal surface is shorter than the maximum length of the sintered metal layer provided on each of the first and second side surfaces.


Find Patent Forward Citations

Loading…