The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 11, 2018

Filed:

May. 29, 2015
Applicant:

Heraeus Precious Metals North America Conshohocken Llc, West Conshohocken, PA (US);

Inventors:

Matthew Sgriccia, Douglassville, PA (US);

Mark Challingsworth, Glenside, PA (US);

Samson Shahbazi, Roslyn, PA (US);

Ryan Persons, Newtown Square, PA (US);

Steven Grabey, Hazleton, PA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C03C 8/02 (2006.01); C03C 8/24 (2006.01); C03C 3/062 (2006.01); C03C 3/083 (2006.01); H01B 3/08 (2006.01); H01B 19/02 (2006.01); C03C 3/064 (2006.01); C03C 3/091 (2006.01); C03C 4/16 (2006.01); C03C 8/16 (2006.01); C03C 8/20 (2006.01); H01G 4/10 (2006.01); H01G 4/12 (2006.01); H01C 17/065 (2006.01);
U.S. Cl.
CPC ...
H01B 3/087 (2013.01); C03C 3/062 (2013.01); C03C 3/064 (2013.01); C03C 3/091 (2013.01); C03C 4/16 (2013.01); C03C 8/16 (2013.01); C03C 8/20 (2013.01); H01B 19/02 (2013.01); H01G 4/105 (2013.01); H01G 4/129 (2013.01); C03C 2207/08 (2013.01); H01C 17/06533 (2013.01);
Abstract

A dielectric glass composition suitable for use in an electronic device which comprises a sufficient amount of silicon dioxide to impart durability to the glass composition when subject to a humid environment, and one or more alkali metal oxides, wherein (i) the total content of the alkali metal oxides is at least about 10 wt % and no more than about 35 wt %, based upon 100% total weight of the glass composition, (ii) the median particle size (d) of the glass composition is no more than about 5 μm, and (iii) the glass composition has a coefficient of thermal expansion of at least about 10 ppm/K and no more than about 25 ppm/K, is provided.


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