The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2018
Filed:
Jul. 18, 2014
Applicant:
Heraeus Deutschland Gmbh & Co. KG, Hanau, DE;
Inventors:
Wilfried Lovenich, Bergisch-Gladbach, DE;
Rüdiger Sauer, Leverkusen, DE;
Udo Guntermann, Krefeld, DE;
Assignee:
HERAEUS DEUTSCHLAND GMBH & CO. KG, Hanau, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/041 (2006.01); C09D 5/24 (2006.01); H01L 51/00 (2006.01); H01L 51/10 (2006.01); H01L 51/44 (2006.01); H01L 51/52 (2006.01); H05K 9/00 (2006.01); H05K 3/06 (2006.01); B22F 7/04 (2006.01); G06F 3/044 (2006.01); B22F 1/00 (2006.01); H05K 1/09 (2006.01); B22F 3/24 (2006.01);
U.S. Cl.
CPC ...
G06F 3/041 (2013.01); B22F 7/04 (2013.01); C09D 5/24 (2013.01); G06F 3/044 (2013.01); H01L 51/0023 (2013.01); H01L 51/102 (2013.01); H01L 51/442 (2013.01); H01L 51/5215 (2013.01); H01L 51/5234 (2013.01); H05K 3/067 (2013.01); H05K 9/0096 (2013.01); B22F 1/0025 (2013.01); B22F 2003/244 (2013.01); B22F 2301/255 (2013.01); G06F 2203/04103 (2013.01); G06F 2203/04112 (2013.01); H05K 1/097 (2013.01); H05K 2201/026 (2013.01); H05K 2203/0789 (2013.01); Y02E 10/549 (2013.01); Y02P 70/521 (2015.11);
Abstract
The present invention relates to the production of a layer structure, comprising the following process steps: The invention also relates to a layer structure obtainable by this method, a layer structure, the use of a layer structure, an electronic component and the use of an organic compound.