The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 11, 2018

Filed:

Mar. 06, 2015
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Shinichiro Watanabe, Kawasaki, JP;

Shinan Wang, Komae, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81C 1/00 (2006.01); G01N 29/24 (2006.01);
U.S. Cl.
CPC ...
G01N 29/2406 (2013.01); B81C 1/00095 (2013.01); G01N 29/2418 (2013.01); B81C 2201/0195 (2013.01); G01N 2291/028 (2013.01); G01N 2291/101 (2013.01);
Abstract

According to a method for manufacturing a device in which an electrode of an element is electrically connected to a penetrating wire in a substrate, a structure is prepared in which the element is arranged on the first substrate having a through hole formed therein: and a second substrate is prepared which has an electroconductive seed layer formed thereon. Then, a wall part is formed on the first substrate; a seed layer is joined to a face on an element side of the structure through a bonding layer; the bonding layer is removed; and the seed layer is exposed in the inside of the opening. The inside of the wall part and the through hole is filled with a conductor, with the use of the seed layer through electrolytic plating.


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