The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2018
Filed:
Dec. 16, 2015
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventors:
Masayasu Sakuma, Kamiina, JP;
Yoshihiro Kobayashi, Komagane, JP;
Shojiro Kitamura, Suwa, JP;
Taketo Chino, Hokuto, JP;
Michiharu Ogami, Sakata, JP;
Assignee:
Seiko Epson Corporation, , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01P 1/02 (2006.01); G01D 11/30 (2006.01); G01D 11/24 (2006.01); G01C 19/5783 (2012.01); G01P 15/18 (2013.01); G01P 1/00 (2006.01);
U.S. Cl.
CPC ...
G01D 11/30 (2013.01); G01C 19/5783 (2013.01); G01D 11/245 (2013.01); G01P 1/00 (2013.01); G01P 1/02 (2013.01); G01P 1/023 (2013.01); G01P 1/026 (2013.01); G01P 15/18 (2013.01);
Abstract
A module includes a sensor device, a mounting substrate that has a plurality of mounting faces, a portion between the mounting faces adjacent to each other being foldable, a supporting member having fixing faces, wherein the sensor device is mounted on at least one of the mounting faces, each of the mounting faces is disposed along each of the fixing faces, and the sensor device is disposed on the supporting member side.