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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10072317 B1

PDFFull Text
Date of Patent:
Sep. 11, 2018

Filed:

Feb. 06, 2015

Filament

Applicant:

Nippon Steel & Sumitomo Metal Corporation, Tokyo, JP;

Inventors:

Daisuke Hirakami, Kisarazu, JP;

Makoto Okonogi, Chiba, JP;

Assignee:

NIPPON STEEL & SUMITOMO METAL CORPORATION, Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Carol M Koslow

Int. Cl.
CPC ...
C22C 38/00 (2006.01); C22C 38/32 (2006.01); B60C 9/00 (2006.01); C21D 8/06 (2006.01); C21D 9/52 (2006.01); C21D 9/573 (2006.01); C22C 38/02 (2006.01); C22C 38/04 (2006.01); C22C 38/06 (2006.01); C22C 38/10 (2006.01); C22C 38/12 (2006.01); C22C 38/14 (2006.01); C22C 38/16 (2006.01); C22C 38/18 (2006.01); C22C 38/20 (2006.01); C22C 38/22 (2006.01); C22C 38/24 (2006.01); C22C 38/26 (2006.01); C22C 38/28 (2006.01); C22C 38/30 (2006.01); C21D 9/64 (2006.01); B65G 15/36 (2006.01);
U.S. Cl.
CPC ...
C21D 9/525 (2013.01); B60C 9/00 (2013.01); B60C 9/0007 (2013.01); C21D 8/06 (2013.01); C21D 8/065 (2013.01); C21D 9/5732 (2013.01); C21D 9/64 (2013.01); C22C 38/00 (2013.01); C22C 38/001 (2013.01); C22C 38/002 (2013.01); C22C 38/005 (2013.01); C22C 38/02 (2013.01); C22C 38/04 (2013.01); C22C 38/06 (2013.01); C22C 38/10 (2013.01); C22C 38/12 (2013.01); C22C 38/14 (2013.01); C22C 38/16 (2013.01); C22C 38/18 (2013.01); C22C 38/20 (2013.01); C22C 38/22 (2013.01); C22C 38/24 (2013.01); C22C 38/26 (2013.01); C22C 38/28 (2013.01); C22C 38/30 (2013.01); C22C 38/32 (2013.01); B65G 15/36 (2013.01); C21D 2201/03 (2013.01); C21D 2211/009 (2013.01);
Abstract

A filament according to an aspect of the present invention includes a predetermined chemical composition, in which a diameter r of the filament is 0.15 mm to 0.35 mm, a soft portion is formed along an outer circumference of the filament, the Vickers hardness of the soft portion is lower than that of a position of the filament at a depth of ¼ of the diameter r by Hv 50 or higher, the thickness of the soft portion is 1 μm to 0.1×r mm, the metallographic structure of a center portion of the filament contains 95% to 100% of pearlite by area %, the average lamellar spacing of pearlite in a portion from a surface of the filament to a depth of 1 μm is less than that of pearlite at the center of the filament, the difference between the average lamellar spacing of pearlite in the portion from the surface of the filament to the depth of 1 μm and the average lamellar spacing of pearlite at the center of the filament is 2.0 nm or less, and the tensile strength is 3200 MPa or higher.

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