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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10072148 B1

PDFFull Text
Date of Patent:
Sep. 11, 2018

Filed:

Nov. 15, 2017

Resin composition, copper clad laminate and printed circuit board using same

Applicant:

Elite Electronic Material (Kunshan) Co. Ltd., Kunshan, Jiangsu Province, CN;

Inventors:

Rongtao Wang, Kunshan, CN;

Yu-Te Lin, Hsien, TW;

Wenjun Tian, Kunshan, CN;

Ziqian Ma, Kunshan, CN;

Wenfeng Lv, Kunshan, CN;

Ningning Jia, Kunshan, CN;

Assignee:

ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD., Kunshan, CN;

Attorney:

Kilpatrick Townsend & Stockton, LLP

Primary Examiner:

Kregg T Brooks

Int. Cl.
CPC ...
C08L 63/00 (2006.01); B32B 15/092 (2006.01); B32B 15/20 (2006.01); B32B 5/02 (2006.01); B32B 15/08 (2006.01); B32B 37/06 (2006.01); B32B 37/12 (2006.01); C08G 59/50 (2006.01); C08G 59/54 (2006.01); C08G 59/56 (2006.01); C08G 59/62 (2006.01); C08L 79/02 (2006.01); C08J 5/24 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); C09D 163/00 (2006.01); C09D 179/02 (2006.01); C08K 3/32 (2006.01); C08K 5/03 (2006.01); C08K 5/3415 (2006.01); C08K 5/3492 (2006.01); C08K 5/49 (2006.01); B32B 15/14 (2006.01); C08G 59/24 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); B32B 5/02 (2013.01); B32B 15/092 (2013.01); B32B 15/14 (2013.01); B32B 15/20 (2013.01); C08G 59/245 (2013.01); C08G 59/50 (2013.01); C08G 59/504 (2013.01); C08G 59/54 (2013.01); C08G 59/56 (2013.01); C08G 59/621 (2013.01); C08J 5/24 (2013.01); H05K 1/0353 (2013.01); H05K 1/09 (2013.01); B32B 2260/021 (2013.01); B32B 2262/101 (2013.01); B32B 2307/3065 (2013.01); B32B 2457/08 (2013.01); C08J 2363/00 (2013.01); C08J 2363/02 (2013.01); C08J 2363/10 (2013.01); C08J 2471/10 (2013.01); C08J 2479/02 (2013.01); C08L 2201/02 (2013.01); C08L 2203/206 (2013.01); C08L 2205/03 (2013.01); H05K 2201/012 (2013.01);
Abstract

The present invention provides a resin composition comprising: (A) 100 parts by weight of epoxy resin; (B) from 10 to 80 parts by weight of benzoxazine resin; (C) from 10 to 50 parts by weight of dicyclopentadiene phenol resin; and (D) from 0.5 to 5 parts by weight of amine hardener; wherein the resin composition is free of diallyl bisphenol A (DABPA).

Find Patent Forward Citations

Wang, Rongtao. (2018). Resin composition, copper clad laminate and printed circuit board using same (U.S. Patent No. 10072148). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10072148

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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