The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 11, 2018

Filed:

Jul. 01, 2016
Applicant:

Fuji Xerox Co., Ltd., Tokyo, JP;

Inventors:

Hiroyuki Moriya, Minamiashigara, JP;

Masayuki Okoshi, Minamiashigara, JP;

Daisuke Nakayama, Minamiashigara, JP;

Tsuyoshi Miyamoto, Minamiashigara, JP;

Yuko Iwadate, Minamiashigara, JP;

Daisuke Nakashima, Ashigarakami-gun, JP;

Toshie Furuya, Ashigarakami-gun, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 23/12 (2006.01); C08K 9/08 (2006.01); C08L 23/06 (2006.01); C08L 23/08 (2006.01); C08K 3/04 (2006.01); C08L 23/10 (2006.01); D06M 101/40 (2006.01); D06M 15/59 (2006.01);
U.S. Cl.
CPC ...
C08L 23/12 (2013.01); C08K 3/04 (2013.01); C08K 9/08 (2013.01); C08L 23/06 (2013.01); C08L 23/0815 (2013.01); C08L 23/0853 (2013.01); C08L 23/10 (2013.01); D06M 15/59 (2013.01); D06M 2101/40 (2013.01);
Abstract

A resin composition contains: polyolefin; a carbon fiber; a resin containing at least one of an amide bond and an imide bond; and a compatibilizer, the resin containing at least one of an amide bond and an imide bond forms a coating layer around the carbon fiber, and a thickness of the coating layer is from 50 nm to 700 nm.


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