The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2018
Filed:
May. 17, 2016
Canon Kabushiki Kaisha, Tokyo, JP;
Satoshi Kimura, Kawasaki, JP;
Yukuo Yamaguchi, Tokyo, JP;
Mikiya Umeyama, Tokyo, JP;
Satoshi Oikawa, Yokohama, JP;
Hiromasa Amma, Kawasaki, JP;
Takuya Iwano, Inagi, JP;
Naoko Tsujiuchi, Kawasaki, JP;
Yasushi Iijima, Tokyo, JP;
Kyosuke Toda, Kawasaki, JP;
CANON KABUSHIKI KAISHA, Tokyo, JP;
Abstract
Provided is a method for manufacturing a liquid-ejecting head whereby in die slide injection molding it is possible to stably inject resin in secondary molding without damaging the shapes of parts that were formed in primary molding. In order for that, in the connecting section in which a convex section of a cover member is inserted into an opening of a liquid-supply member, the closest distance to the opening in the area where secondary resin is injected is made larger than the gap between the opening and the convex section. As a result, the resin is prevented from flowing into a liquid path during the secondary molding.