The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 11, 2018

Filed:

Apr. 05, 2016
Applicant:

Fuji Manufacturing Co., Ltd, Tokyo, JP;

Inventors:

Keiji Mase, Tokyo, JP;

Daisuke Chino, Tokyo, JP;

Masato Hinata, Tokyo, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24C 1/04 (2006.01); B24C 3/18 (2006.01); B24C 3/32 (2006.01);
U.S. Cl.
CPC ...
B24C 3/18 (2013.01); B24C 1/04 (2013.01); B24C 1/045 (2013.01); B24C 3/32 (2013.01);
Abstract

To cut out a hard-brittle substrate by blasting, laying out substrateson a plate materialmade of a hard-brittle material with leaving a space for blasting; forming first protective filmson both surfaces of the plate materialat layout positions of the substrates; and forming second protective filmson both surfaces of a marginof the plate materialwith leaving a space with respect to the first protective filmsand having outer edges from a periphery of the plate materialat a width of 5 mm or less; cutting regionsbetween the filmsand between the filmsfrom one surface of the plate materialto a depth of approximately half of a thickness thereof by blasting, then cutting from the other surface of the plate materialuntil the plate materialis penetrated.


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