The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2018
Filed:
Sep. 23, 2014
Applicant:
3m Innovative Properties Company, St. Paul, MN (US);
Inventors:
Paul S Lugg, Woodbury, MN (US);
Duy K Lehuu, Lake Elmo, MN (US);
Assignee:
3M Innovative Properties Company, St. Paul, MN (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/22 (2012.01); B24B 37/24 (2012.01); B24B 37/04 (2012.01); B24B 7/20 (2006.01); C09G 1/02 (2006.01); B24B 37/26 (2012.01);
U.S. Cl.
CPC ...
B24B 37/22 (2013.01); B24B 7/20 (2013.01); B24B 37/044 (2013.01); B24B 37/24 (2013.01); C09G 1/02 (2013.01); B24B 37/26 (2013.01);
Abstract
A multi-layered polishing pad arrangement includes a first polishing pad layer having a first top and a first bottom major surface, a second polishing pad layer having a second top and a second bottom major surface, and a coupling arrangement disposed between the first bottom surface and the second top surface. The thickness of each of the first and second polishing pad layer ranges between 0.125 mm and 10 mm.