The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2018
Filed:
Nov. 16, 2016
Applicant:
Denso Corporation, Kariya, Aichi-pref., JP;
Inventors:
Assignee:
DENSO CORPORATION, Kariya, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H02M 7/00 (2006.01); H02M 7/537 (2006.01); H05K 5/02 (2006.01); H05K 5/04 (2006.01);
U.S. Cl.
CPC ...
H05K 7/209 (2013.01); H02M 7/003 (2013.01); H02M 7/537 (2013.01); H05K 5/0256 (2013.01); H05K 5/04 (2013.01); H05K 7/2049 (2013.01); B60L 2210/40 (2013.01); B60L 2240/525 (2013.01);
Abstract
An electric power converter performing power conversion includes a plurality of semiconductor modules with built-in semiconductor elements, a plurality of cooling tubes stacked together with the plurality of semiconductor modules, and a pressure member made of metal. The pressure member has a pressing surface for pressing an outer cooling tube in order to press-contact the plurality of cooling tubes and the plurality of semiconductor modules in a stacking direction, and a heat receiving surface that receives heat generated from a capacitor that is an electronic component which is different from the plurality of semiconductor modules, by thermal conduction.