The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 04, 2018

Filed:

Sep. 17, 2015
Applicant:

Htc Corporation, Taoyuan, TW;

Inventors:

Sheng-Ming Liu, Taoyuan, TW;

Chin-Kai Sun, Taoyuan, TW;

Assignee:

HTC Corporation, Taoyuan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 7/14 (2006.01); H04M 1/02 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 7/1427 (2013.01); H04M 1/0249 (2013.01); H05K 1/028 (2013.01); H05K 1/181 (2013.01);
Abstract

An electronic device and a component module thereof are provided, wherein the electronic device includes a housing, a component and a flexible substrate. The housing has a mounting region, and the component is disposed in the mounting region. The flexible substrate includes a bonding portion and an extending portion, wherein the bonding portion is disposed between the component and a carrying surface of the mounting region. The mounting portion has a first surface and a second surface opposite to the first surface, wherein the first surface is bonded to the component, and the second surface is bonded to the carrying surface. The extending portion is connected to the bonding portion and extended to the outside of the mounting region.


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