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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10070530 B1

PDFFull Text
Date of Patent:
Sep. 04, 2018

Filed:

Jul. 10, 2017

Electronic component and manufacturing method thereof

Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventors:

Motohiro Toyonaga, Kyoto, JP;

Yasuhiro Fuwa, Kyoto, JP;

Mamoru Yamagami, Kyoto, JP;

Isamu Nishimura, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:

Rabin & Berdo, P.C.

Primary Examiner:

Andargie M Aychillhum

Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/28 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/186 (2013.01); H01L 21/481 (2013.01); H01L 21/4853 (2013.01); H01L 23/13 (2013.01); H01L 23/3121 (2013.01); H01L 23/49811 (2013.01); H01L 23/562 (2013.01); H01L 24/16 (2013.01); H01L 24/97 (2013.01); H05K 1/0271 (2013.01); H05K 1/111 (2013.01); H05K 3/0052 (2013.01); H05K 3/284 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/15153 (2013.01); H05K 2201/09018 (2013.01); H05K 2201/10636 (2013.01); H05K 2203/1316 (2013.01);
Abstract

An electronic component includes a substrate including a first principal surface, a second principal surface positioned on a side opposite to the first principal surface, a first side surface that connects the first principal surface and the second principal surface and that extends along a first direction, a second side surface that connects the first principal surface and the second principal surface and that extends along a second direction intersecting the first direction, and a corner portion that connects the first side surface and the second side surface and that has a curved surface curved outwardly, and a chip arranged at the first principal surface of the substrate.

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