The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 04, 2018

Filed:

Apr. 14, 2015
Applicant:

Fuji Electric Co., Ltd., Kawasaki-shi, JP;

Inventors:

Hideyo Nakamura, Matsumoto, JP;

Masafumi Horio, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki-Shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H05K 1/18 (2006.01); H01L 23/373 (2006.01); H01L 25/07 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H05K 1/02 (2006.01); H05K 7/20 (2006.01); H05K 3/34 (2006.01); H01L 23/04 (2006.01); H01L 25/18 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H01L 23/04 (2013.01); H01L 23/3107 (2013.01); H01L 23/3735 (2013.01); H01L 23/49833 (2013.01); H01L 24/17 (2013.01); H01L 25/072 (2013.01); H05K 1/0212 (2013.01); H05K 1/0296 (2013.01); H05K 3/3447 (2013.01); H05K 7/2089 (2013.01); H01L 21/565 (2013.01); H01L 25/18 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/181 (2013.01); H01L 2924/30107 (2013.01); H05K 1/0243 (2013.01); H05K 2201/0364 (2013.01); H05K 2201/06 (2013.01); H05K 2201/09972 (2013.01);
Abstract

A semiconductor device, while being small, makes it possible to achieve low inductance responding to high speed switching. The semiconductor device includes a plurality of conductive pattern members, on each of which is mounted one or a plurality of power semiconductor chips, and a printed circuit board wherein a chip rod-form conductive connection member connected to the power semiconductor chip and a pattern rod-form conductive connection member connected to the conductive pattern member are disposed on the surface opposing the conductive pattern member. The conductive pattern member is formed of a narrow portion and a wide portion, the narrow portion of at least one conductive pattern member and the printed circuit board are connected by the pattern rod-form conductive connection member, and a current path is formed between the conductive pattern member and the power semiconductor chip connected via the chip rod-form conductive connection member to the printed circuit board.


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