The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2018
Filed:
Mar. 29, 2013
Applicant:
Jx Nippon Mining & Metals Corporation, Tokyo, JP;
Inventor:
Ryo Fukuchi, Ibaraki, JP;
Assignee:
JX Nippon Mining & Metals Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 1/03 (2006.01); H05K 1/02 (2006.01); C23C 28/00 (2006.01); C23C 30/00 (2006.01); B32B 15/04 (2006.01); C23C 22/24 (2006.01); C23C 22/83 (2006.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
H05K 1/09 (2013.01); C23C 22/24 (2013.01); C23C 22/83 (2013.01); C23C 30/00 (2013.01); C23C 30/005 (2013.01); H05K 1/0242 (2013.01); H05K 1/0393 (2013.01); H05K 3/382 (2013.01); H05K 3/389 (2013.01); C23C 2222/20 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/032 (2013.01); H05K 2201/0355 (2013.01); Y10T 428/12056 (2015.01); Y10T 428/1291 (2015.01); Y10T 428/12556 (2015.01); Y10T 428/12569 (2015.01); Y10T 428/12847 (2015.01); Y10T 428/12882 (2015.01); Y10T 428/12903 (2015.01); Y10T 428/12917 (2015.01); Y10T 428/12937 (2015.01); Y10T 428/26 (2015.01); Y10T 428/263 (2015.01); Y10T 428/27 (2015.01); Y10T 428/273 (2015.01);
Abstract
This surface-treated copper foil is characterized in that the amount of adhesion of Si on the copper foil surface is from 3.1 to 300 μg/dm, and the amount of adhesion of N on the copper foil surface is from 2.5 to 690 μg/dm. The objective of the present invention is to obtain a copper foil having improved peel strength in providing a copper foil for a flexible printed substrate (FPC), in which a copper foil is laminated to a liquid crystal polymer (LCP) suitable for high-frequency applications.