The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2018
Filed:
Apr. 26, 2016
Shenzhen China Star Optoelectronics Technology Co., Ltd., Shenzhen, CN;
Yawei Liu, Shenzhen, CN;
SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD., Shenzhen, Guangdong, CN;
Abstract
The present invention provides a package method of a substrate. By forming a plurality of support parts which are separately located at the border position of the package cover plate, the gap of the package cover plate and the substrate is limited after para bonding the package cover plate and the substrate. Thus, the seal height of the seal which does not contain the spacers can be ensured, and under circumstance of certain seal coating volume, the seal width of the seal also can be ensured. Furthermore, by cutting off the plurality of support parts, and border parts of the substrate and the package cover plate contacting with the support parts, the substrate packaged with the seal which does not contain the spacers can be obtained, and it is ensured that the seal has the consistent height and width.