The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 04, 2018

Filed:

Feb. 14, 2017
Applicant:

Stmicroelectronics S.r.l., Agrate Brianza, IT;

Inventors:

Alberto Pagani, Nova Milanese, IT;

Alessandro Finocchiaro, Catania, IT;

Assignee:

STMicroelectronics S.r.l., Agrate Brianza, IT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 49/02 (2006.01); H01L 23/58 (2006.01); H01L 23/66 (2006.01); H01L 23/528 (2006.01); H01L 29/06 (2006.01); H01L 23/00 (2006.01); H01L 21/66 (2006.01); G01R 31/28 (2006.01); G01R 31/302 (2006.01);
U.S. Cl.
CPC ...
H01L 28/10 (2013.01); G01R 31/2834 (2013.01); G01R 31/2889 (2013.01); G01R 31/3025 (2013.01); H01L 22/34 (2013.01); H01L 23/528 (2013.01); H01L 23/564 (2013.01); H01L 23/585 (2013.01); H01L 23/66 (2013.01); H01L 24/05 (2013.01); H01L 29/0642 (2013.01); H01L 2223/6677 (2013.01); H01L 2924/30107 (2013.01);
Abstract

An integrated circuit on a substrate includes a peripheral portion that surrounds an active area and is positioned close to a scribe line providing separation with other integrated circuits realized on a same wafer. The integrated circuit includes at least one conductive structure that extends in the peripheral portion on different planes of metallizations starting from the substrate and forms an integrated antenna. Another conductive structure extends in the peripheral portion on different planes of metallizations and forms a seal ring.


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