The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 04, 2018

Filed:

Mar. 04, 2016
Applicant:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Inventors:

Yuta Kugiyama, Buzen Fukuoka, JP;

Hisami Saito, Kitakyushu Fukuoka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2006.01); H01L 31/02 (2006.01); H01L 33/62 (2010.01); H01L 31/167 (2006.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 25/165 (2013.01); H01L 31/02005 (2013.01); H01L 31/167 (2013.01); H01L 33/62 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/8592 (2013.01); H01L 2924/181 (2013.01);
Abstract

An optical coupling device includes a first receiving chip having a first region on one end and a second region on another end side. A first emitting chip is disposed on the first region. A second receiving chip has a third region on one end and a fourth region on another end. A second emitting chip is disposed on the fourth region. The first and third regions are adjacent, and the second and fourth regions are adjacent. A first connection portion is disposed on the second region and is electrically connected to the second light emitting chip through a bonding wire. A second connection portion is disposed in the third region and is electrically connected to the first light emitting chip through a bonding wire.


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