The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2018
Filed:
Dec. 28, 2016
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Heungkyu Kwon, Seongnam-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, Gyeonggi-do, KR;
Abstract
Provided are a package-on-package type semiconductor package and a method of fabricating the same. The semiconductor package includes upper package stacked on a lower package and a via provided between the lower and upper packages to electrically connect the lower and upper packages to each other. The lower package includes a lower package substrate, a lower semiconductor chip mounted on the lower package substrate, and a lower mold layer encapsulating the lower semiconductor chip and including an alignment mark. The lower mold layer includes a marking region, which is provided between the via and the lower semiconductor chip, and on which the alignment mark is provided.