The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 04, 2018

Filed:

Jun. 08, 2015
Applicant:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, Ibaraki, JP;

Inventors:

Nobutake Tsuyuno, Tokyo, JP;

Junpei Kusukawa, Tokyo, JP;

Takeshi Tokuyama, Tokyo, JP;

Tokihito Suwa, Ibaraki, JP;

Assignee:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/07 (2006.01); H01L 23/367 (2006.01); H02M 7/537 (2006.01); H01L 23/495 (2006.01); H02M 7/00 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 25/072 (2013.01); H01L 23/3677 (2013.01); H01L 23/3735 (2013.01); H01L 23/49575 (2013.01); H02M 7/003 (2013.01); H02M 7/537 (2013.01);
Abstract

It is an object of the present invention to provide a power module which can withstand a high voltage with a thin insulating layer. A power module of the present invention is provided with a first power semiconductor elementof an upper arm side constituting an inverter circuit, a second power semiconductor elementof a lower arm side, a first conductor partwhich transmits an alternating current, a second conductor partwhich transmits a direct current, an electrically-conductive heat dissipating part, a first intermediate conductor layerdisposed between the first conductor partand the heat dissipating partvia an insulating layer, and a second intermediate conductor layerdisposed between the second conductor partand the heat dissipating partvia the insulating layer, wherein, the second intermediate conductor layeris formed to be separated from the first intermediate conductor layer, and the first intermediate conductor layerforms a capacity circuit which shares the voltage between the first conductor partand the heat dissipating part


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