The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 04, 2018

Filed:

Mar. 06, 2016
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Tatsuya Kabe, Osaka, JP;

Hideyuki Arai, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 23/528 (2006.01); H01L 23/58 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H01L 23/532 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 23/528 (2013.01); H01L 23/5329 (2013.01); H01L 23/562 (2013.01); H01L 23/564 (2013.01); H01L 23/58 (2013.01); H01L 23/585 (2013.01); H01L 24/83 (2013.01); H01L 25/065 (2013.01); H01L 25/07 (2013.01); H01L 25/18 (2013.01); H01L 21/76898 (2013.01); H01L 23/53223 (2013.01); H01L 23/53238 (2013.01); H01L 23/53252 (2013.01); H01L 2224/06505 (2013.01); H01L 2224/09505 (2013.01); H01L 2224/14505 (2013.01); H01L 2224/17505 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/29186 (2013.01); H01L 2224/29191 (2013.01); H01L 2224/83895 (2013.01); H01L 2225/06558 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A semiconductor devise includes a first substrate and a second substrate which are bonded each other. A first substrate includes an insulating first surface film as an uppermost layer, a first electrode and an insulating second surface film respectively formed inside a plurality of openings in the first surface film, and a first seal ring. A second substrate includes an insulating third surface film as an uppermost layer, and a second electrode, an insulating fourth surface film respectively formed inside a plurality of openings in the third surface film, and a second seal ring. The first electrode and the second electrode are directly bonded together. The first surface film and the third surface film are directly bonded together. The second surface film and the fourth surface film are directly bonded together. A seal ring formed of the first seal ring, the second surface film, the fourth surface film, and the second seal ring is continuous between the first substrate and the second substrate.


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