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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10068870 B1

PDFFull Text
Date of Patent:
Sep. 04, 2018

Filed:

Mar. 04, 2016

Semiconductor device including a connection unit and semiconductor device fabrication method of the same

Applicant:

Fuji Electric Co., Ltd., Kawasaki-shi, JP;

Inventors:

Norihiro Nashida, Nagano, JP;

Hideyo Nakamura, Matsumoto, JP;

Yoko Nakamura, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kasasaki-Shi, JP;

Attorney:

Rabin & Berdo, P.C.

Primary Examiner:

Alonzo Chambliss

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/00 (2006.01); H05K 5/00 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2006.01); H01L 25/07 (2006.01); H01L 25/11 (2006.01); H01L 25/00 (2006.01); H01L 23/31 (2006.01); H01L 23/40 (2006.01);
U.S. Cl.
CPC ...
H01L 24/29 (2013.01); H01L 21/486 (2013.01); H01L 23/49827 (2013.01); H01L 23/49833 (2013.01); H01L 24/83 (2013.01); H01L 24/97 (2013.01); H01L 25/0655 (2013.01); H01L 25/071 (2013.01); H01L 25/115 (2013.01); H01L 23/3121 (2013.01); H01L 23/40 (2013.01); H01L 25/50 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/8384 (2013.01);
Abstract

A semiconductor device includes a plurality of semiconductor units each including a laminated substrate formed by laminating an insulating board and a circuit board and a semiconductor element joined to the circuit board using a joining material which irreversibly makes a phase transition into a solid-phase state. In addition, the semiconductor device may include a base plate to which each of the plurality of semiconductor units is joined using solder and a connection unit which electrically connects the plurality of semiconductor units in parallel.

Find Patent Forward Citations

Nashida, Norihiro. (2018). Semiconductor device including a connection unit and semiconductor device fabrication method of the same (U.S. Patent No. 10068870). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10068870

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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