The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2018
Filed:
Dec. 13, 2017
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventors:
Eun-bong Han, Suwon-si, KR;
Hyeon-hyang Kim, Seoul, KR;
Assignee:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H01L 23/552 (2006.01); H01L 23/495 (2006.01); H01L 23/22 (2006.01); H01L 23/427 (2006.01); H05K 9/00 (2006.01); H05K 7/20 (2006.01); G06F 1/20 (2006.01); H05K 1/02 (2006.01); H01L 23/367 (2006.01); F28D 15/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/427 (2013.01); F28D 15/0233 (2013.01); G06F 1/203 (2013.01); H01L 23/3675 (2013.01); H01L 23/552 (2013.01); H05K 1/0216 (2013.01); H05K 7/2099 (2013.01); H05K 7/20336 (2013.01); H05K 9/0088 (2013.01);
Abstract
An electromagnetic interference shielding structure is disclosed. The electromagnetic interference shielding structure includes an insulating member covering at least one circuit element mounted on a printed circuit board (PCB), a shielding member covering the insulating member, and a heat dissipator having a surface adhering to the shielding member to transfer heat emitted from the at least one circuit element to a place where temperature is relatively low.