The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2018
Filed:
Sep. 14, 2016
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Thomas A Kim, Suwon-si, KR;
Kyu Bum Han, Suwon-si, KR;
Chang Moo Jung, Suwon-si, KR;
Kyung In Kang, Suwon-si, KR;
Sang Kyu Lee, Suwon-si, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Abstract
An electronic component package includes a frame, an electronic component, an encapsulant, a metal layer, and a redistribution layer. The frame has a through hole. The electronic component is disposed in the through hole of the frame and has an active surface on which electrode pads are formed and an inactive surface opposing the active surface. The encapsulant covers the inactive surface of the electronic component and is disposed between the frame and the electronic component within the through hole. The metal layer is formed on a surface of the encapsulant. The redistribution layer is disposed adjacently to the active surface of the electronic component and electrically connected to the electrode pads.