The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2018
Filed:
Nov. 09, 2017
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Pil Joong Kang, Suwon-si, KR;
Kwang Su Kim, Suwon-si, KR;
Ji Hye Nam, Suwon-si, KR;
Jeong Il Lee, Suwon-si, KR;
Jong Hyeong Song, Suwon-si, KR;
Yun Sung Kang, Suwon-si, KR;
Seung Joo Shin, Suwon-si, KR;
Nam Jung Lee, Suwon-si, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Abstract
The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, and a cap enclosing the element. One of the substrate and the cap includes a groove, the other of the substrate and the cap includes a protrusion engaging with the groove. A first metal layer and a second metal layer form a metallic bond with each other in a space between the groove and the protrusion.