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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10068818 B1

PDFFull Text
Date of Patent:
Sep. 04, 2018

Filed:

May. 18, 2016

Semiconductor element package, semiconductor device, and mounting structure

Applicant:

Kyocera Corporation, Kyoto-shi, Kyoto, JP;

Inventor:

Yoshiki Kawazu, Higashiomi, JP;

Assignee:

Kyocera Corporation, Kyoto, JP;

Attorney:

Volpe and Koenig, P.C.

Primary Examiner:

Dao H Nguyen

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/047 (2006.01); H01S 5/022 (2006.01); H05K 7/02 (2006.01); H01L 23/057 (2006.01); H01L 23/12 (2006.01); H01L 31/0203 (2014.01); H01L 23/373 (2006.01); H05K 7/00 (2006.01); H01L 23/498 (2006.01); H01L 23/043 (2006.01); H05K 7/18 (2006.01); H01L 23/48 (2006.01); H05K 5/02 (2006.01); H05K 5/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/057 (2013.01); H01L 23/043 (2013.01); H01L 23/12 (2013.01); H01L 23/373 (2013.01); H01L 23/48 (2013.01); H01L 23/498 (2013.01); H01L 31/0203 (2013.01); H01S 5/02284 (2013.01); H05K 5/00 (2013.01); H05K 5/02 (2013.01); H05K 7/00 (2013.01); H05K 7/02 (2013.01); H05K 7/18 (2013.01);
Abstract

A semiconductor element package includes a base body, a frame member, and a terminal member. The frame member is provided on a main surface of the base body. A notch is formed on the base body side of this frame member. The notch is a gap between the one main surface of the base body and the frame member. The terminal member is provided so as to cover the notch as the gap. The terminal member includes a first dielectric layer, a plurality of signal wiring conductors and a plurality of coplanar ground conductor layers that are provided on one surface of the first dielectric layer, and a second dielectric layer. The first dielectric layer has a hole provided open in a region of the one surface between a first wiring conductor and a second wiring conductor.

Find Patent Forward Citations

Kawazu, Yoshiki. (2018). Semiconductor element package, semiconductor device, and mounting structure (U.S. Patent No. 10068818). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10068818

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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