The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2018
Filed:
Mar. 20, 2017
Macom Technology Solutions Holdings, Inc., Lowell, MA (US);
Paul Bovaird, Pleasanton, CA (US);
Stefano D'Agostino, Los Altos, CA (US);
Vikas Manan, Cupertino, CA (US);
MACOM Technology Solutions Holdings, Inc., Lowell, MA (US);
Abstract
A semiconductor package and die assembly with a package having an exterior surface and an interior space, the interior space defined by a first side wall, and a second side wall that opposes the first side wall. Also part of the assembly is a package floor and a package ceiling. The package floor includes package floor conductors. The package ceiling opposes the package floor and includes package ceiling conductors in the package ceiling. One or more semiconductor dies are on the floor of the package floor. Electrical conductors electrically connect the one or more floor dies to the package floor conductors. One or more semiconductor dies are located on the package ceiling. Electrical conductors are configured to electrically connect the one or more ceiling dies to the package ceiling conductors. An air space is located between the package floor and the package ceiling.