The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2018
Filed:
Sep. 21, 2016
Murata Manufacturing Co., Ltd., Kyoto-fu, JP;
Takanori Osada, Nagaokakyo, JP;
Atsushi Takahashi, Nagaokakyo, JP;
Murata Manufacturing Co., Ltd., Kyoto-fu, JP;
Abstract
The variation between different product lots is reduced for plating growth dimensions of plated films to serve as external electrodes. The correlation is grasped in advance among the surface resistance value of a ceramic body, the applying charge amount for electrolytic plating, an actual plating growth dimension obtained when the ceramic body with the surface resistance value is subjected to plating with the foregoing applying charge amount. The surface resistance value is measured for the ceramic body on which plated films to serve as external electrodes are to be formed by applying electrolytic plating, and the applying charge amount required for plating is determined by applying the surface resistance value and a designed value for an intended plating growth dimension to the correlation mentioned above. Thereafter, in order to form the plated films, the ceramic body is subjected to electrolytic plating, with the applying charge amount determined.