The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 04, 2018

Filed:

Nov. 03, 2015
Applicant:

Cyntec Co., Ltd., Hsinchu, TW;

Inventors:

Chun-Chih Lin, Hisnchu, TW;

Yi-Wei Chen, Hsinchu, TW;

Yi-Ting Lai, Hsinchu, TW;

Chu-keng Lin, Hsinchu, TW;

Cheng-Chang Lee, Hsinchu, TW;

Assignee:

CYNTEC CO., LTD., Hsinchu, TW;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 27/32 (2006.01); H01F 27/28 (2006.01); H01F 27/24 (2006.01); H05K 1/16 (2006.01); H05K 1/09 (2006.01); H05K 1/02 (2006.01); H05K 3/20 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 27/24 (2013.01); H05K 1/165 (2013.01); H01F 2027/2809 (2013.01); H05K 1/0298 (2013.01); H05K 1/09 (2013.01); H05K 3/202 (2013.01); H05K 2201/086 (2013.01);
Abstract

A multi-layer wiring structure includes a first conductive structure, a second conductive structure and an insulating layer. To manufacturing the multi-layer wiring structure, a first conductive structure and a second conductive structure are provided. The first conductive structure and the second conductive structure include a plurality of wiring patterns. Then, the insulating layer is disposed between the first conductive structure and the second conductive structure. The insulting layer is thinner than the first conductive structure or the second conductive structure. The first conductive structure, the insulating layer and the second conductive structure are laminated to form the multi-layer wiring structure. A planar magnetic element having a compact coil manufactured by the method is also provided.


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