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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10067073 B1

PDFFull Text
Date of Patent:
Sep. 04, 2018

Filed:

Mar. 01, 2016

Method of manufacturing printed circuit board and method of inspecting printed circuit board

Applicant:

Nitto Denko Corporation, Ibaraki-shi, Osaka, JP;

Inventor:

Yoshihiro Toyoda, Ibaraki, JP;

Assignee:

NITTO DENKO CORPORATION, Osaka, JP;

Attorney:

Panitch Schwarze Belisario & Nadel LLP

Primary Examiner:

Peter DungBa Vo

Assistant Examiner:

Joshua D Anderson

Int. Cl.
CPC ...
G01N 21/956 (2006.01); G01N 21/88 (2006.01); H05K 3/10 (2006.01); G01N 21/89 (2006.01); H05K 1/02 (2006.01); H05K 13/08 (2006.01); H05K 1/05 (2006.01);
U.S. Cl.
CPC ...
G01N 21/956 (2013.01); G01N 21/8806 (2013.01); G01N 21/8901 (2013.01); G01N 21/95684 (2013.01); H05K 1/0269 (2013.01); G01N 2021/8845 (2013.01); G01N 2021/8887 (2013.01); G01N 2021/8909 (2013.01); G01N 2021/95638 (2013.01); G01N 2021/95661 (2013.01); H05K 1/056 (2013.01); H05K 13/08 (2013.01); H05K 2201/0154 (2013.01); H05K 2203/163 (2013.01); Y10T 29/49004 (2015.01); Y10T 29/49124 (2015.01); Y10T 29/53022 (2015.01); Y10T 29/53087 (2015.01);
Abstract

A base insulating layer and a cover insulating layer of a first printed circuit board are formed of a first insulating material, and a base insulating layer and a cover insulating layer of a second printed circuit board are formed of a second insulating material. During inspection of the first printed circuit board, the first printed circuit board is irradiated with first light having a peak wavelength in a first wavelength range, and an image is produced based on reflected light from the first printed circuit board. During inspection of the second printed circuit board, the second printed circuit board is irradiated with second light having a peak wavelength in a second wavelength region different from the first wavelength region, and an image is produced based on reflected light from the second printed circuit board.

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