The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 04, 2018

Filed:

Jul. 20, 2016
Applicant:

Alps Electric Co., Ltd., Tokyo, JP;

Inventor:

Junichi Saito, Miyagi-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01P 1/02 (2006.01); G01P 15/00 (2006.01); G01C 19/574 (2012.01); H01L 25/065 (2006.01); G01C 19/56 (2012.01);
U.S. Cl.
CPC ...
G01C 19/574 (2013.01); G01C 19/56 (2013.01); G01P 1/02 (2013.01); G01P 15/00 (2013.01); H01L 25/0655 (2013.01); H01L 25/0657 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49171 (2013.01); H01L 2924/181 (2013.01);
Abstract

A sensor chip includes sensor pads, and the first set of differential detection signal pads are symmetrically arranged on both sides of a ground pad and are centered at the ground pad, the second set of differential detection signal pads are arranged on both sides thereof, and a power supply pad is arranged in one end of the two ends of the sensor pads. A processing circuit chip includes sensor connection pads including power supply connection pads, a ground connection pad, and two sets of differential detection signal connection pads, and the power supply connection pads connectable to the power supply pad of the sensor chip are arranged in two ends of the sensor connection pads.


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