The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 04, 2018

Filed:

Nov. 03, 2016
Applicant:

Baker Hughes Incorporated, Houston, TX (US);

Inventors:

Soma Chakraborty, Houston, TX (US);

Anthony A. DiGiovanni, Houston, TX (US);

Gaurav Agrawal, Aurora, CO (US);

Assignee:

Baker Hughes Incorporated, Houston, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
E21B 10/567 (2006.01); C04B 35/626 (2006.01); C04B 35/632 (2006.01); C04B 35/645 (2006.01); B22F 1/00 (2006.01); C22C 1/05 (2006.01); C22C 26/00 (2006.01); B24D 3/06 (2006.01); B24D 3/34 (2006.01); B24D 18/00 (2006.01); E21B 10/56 (2006.01); C04B 35/528 (2006.01); C04B 35/628 (2006.01); C04B 37/00 (2006.01); C01B 32/28 (2017.01); E21B 10/55 (2006.01);
U.S. Cl.
CPC ...
E21B 10/567 (2013.01); B22F 1/0062 (2013.01); B24D 3/06 (2013.01); B24D 3/34 (2013.01); B24D 18/0009 (2013.01); C01B 32/28 (2017.08); C04B 35/528 (2013.01); C04B 35/6261 (2013.01); C04B 35/62655 (2013.01); C04B 35/62802 (2013.01); C04B 35/632 (2013.01); C04B 35/645 (2013.01); C04B 37/001 (2013.01); C22C 1/051 (2013.01); C22C 26/00 (2013.01); E21B 10/56 (2013.01); C04B 2235/3206 (2013.01); C04B 2235/3217 (2013.01); C04B 2235/3852 (2013.01); C04B 2235/427 (2013.01); C04B 2235/5427 (2013.01); C04B 2235/5436 (2013.01); C04B 2235/5445 (2013.01); C04B 2235/5472 (2013.01); C04B 2237/363 (2013.01); C04B 2237/401 (2013.01); E21B 10/55 (2013.01);
Abstract

Methods of fabricating polycrystalline diamond include subjecting a particle mixture to high pressure and high temperature (HPHT) conditions to form inter-granular diamond-to-diamond bonds. Before being subjected to HPHT conditions, the particle mixture includes a plurality of non-diamond nanoparticles, diamond nanoparticles, and diamond grit. The non-diamond nanoparticles includes carbon-free cores and at least one functional group attached to the cores. Cutting elements for use in an earth-boring tool include a polycrystalline diamond material formed by such processes. Earth-boring tools include such cutting elements.


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