The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 04, 2018

Filed:

Jan. 29, 2016
Applicant:

Hitachi Kokusai Electric Inc., Tokyo, JP;

Inventors:

Ryuji Yamamoto, Kodaira, JP;

Satoshi Shimamoto, Toyama, JP;

Yoshiro Hirose, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/52 (2006.01); C23C 16/36 (2006.01); C23C 16/38 (2006.01); C23C 16/455 (2006.01); H01L 21/02 (2006.01); C23C 16/44 (2006.01); C23C 16/46 (2006.01);
U.S. Cl.
CPC ...
C23C 16/52 (2013.01); C23C 16/36 (2013.01); C23C 16/38 (2013.01); C23C 16/4412 (2013.01); C23C 16/45523 (2013.01); C23C 16/46 (2013.01); H01L 21/0228 (2013.01); H01L 21/02126 (2013.01); H01L 21/02167 (2013.01); H01L 21/02271 (2013.01);
Abstract

A technique includes forming a film containing a first element, a second element, and carbon on a substrate by performing a cycle a predetermined number of times. The cycle includes non-simultaneously performing: forming a first solid layer containing the first element and carbon, and having a thickness of more than one atomic layer and equal to or less than several atomic layers, by supplying a precursor gas having a chemical bond of the first element and carbon to the substrate and confining the precursor gas within the process chamber, under a condition in which the precursor gas is autolyzed and at least a part of the chemical bond of the first element and carbon is maintained without being broken; and forming a second solid layer by supplying a reaction gas containing the second element to the substrate to modify the first solid layer.


Find Patent Forward Citations

Loading…