The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 04, 2018

Filed:

Jan. 20, 2016
Applicant:

Sekisui Chemical Co., Ltd., Osaka, Osaka, JP;

Inventors:

Mitsuru Tanikawa, Osaka, JP;

Takashi Watanabe, Osaka, JP;

Yusuke Fujita, Osaka, JP;

Yoshito Fujita, Osaka, JP;

Tasuku Yamada, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 2/46 (2006.01); C08G 61/04 (2006.01); C09D 133/14 (2006.01); C09J 5/06 (2006.01); C09J 163/00 (2006.01); C09J 201/02 (2006.01); H01L 21/52 (2006.01); C09J 171/12 (2006.01); H01L 23/00 (2006.01); C09D 11/101 (2014.01); C09D 11/107 (2014.01); C09D 11/30 (2014.01); C09D 11/52 (2014.01); C09D 133/10 (2006.01); C09J 5/04 (2006.01); C09J 9/02 (2006.01); C09J 133/10 (2006.01); C09J 133/14 (2006.01); C08G 59/42 (2006.01); C08G 59/68 (2006.01);
U.S. Cl.
CPC ...
C09D 133/14 (2013.01); C08G 59/4215 (2013.01); C08G 59/686 (2013.01); C09D 11/101 (2013.01); C09D 11/107 (2013.01); C09D 11/30 (2013.01); C09D 11/52 (2013.01); C09D 133/10 (2013.01); C09J 5/04 (2013.01); C09J 5/06 (2013.01); C09J 9/02 (2013.01); C09J 133/10 (2013.01); C09J 133/14 (2013.01); C09J 163/00 (2013.01); C09J 171/12 (2013.01); C09J 201/02 (2013.01); H01L 21/52 (2013.01); H01L 24/27 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 24/91 (2013.01); C09J 2203/326 (2013.01); C09J 2205/114 (2013.01); C09J 2205/31 (2013.01); C09J 2433/00 (2013.01); C09J 2461/00 (2013.01); C09J 2463/00 (2013.01); H01L 2224/2741 (2013.01); H01L 2224/2783 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8322 (2013.01); H01L 2224/83026 (2013.01); H01L 2224/83359 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/83947 (2013.01); H01L 2924/00014 (2013.01);
Abstract

Provided is an inkjet adhesive which is applied using an inkjet device, wherein the adhesive can suppress generation of voids in the adhesive layer and, after bonding, can reduce an outgas at the time of being exposed to high temperatures, and can enhance moisture-resistant reliability. An inkjet adhesive according to the present invention comprises a first photocurable compound having one (meth)acrylol group, a second photocurable compound having two or more (meth)acrylol groups, a photo-radical initiator, a thermosetting compound having one or more cyclic ether groups or cyclic thioether groups, and a compound capable of reacting with the thermosetting compound, and the first photocurable compound contains alkyl (meth)acrylate having 8 to 21 carbon atoms.


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