The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 04, 2018

Filed:

Sep. 17, 2015
Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Kwon Il Choi, Daejeon, KR;

Myong Jo Ham, Daejeon, KR;

Eon Seok Lee, Daejeon, KR;

Cheol-Hee Park, Daejeon, KR;

Han Nah Jeong, Daejeon, KR;

Jae Hyun Kim, Daejeon, KR;

Shin Hee Jun, Daejeon, KR;

Eun Kyu Seong, Daejeon, KR;

Assignee:

LG Chem, Ltd., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 2/40 (2006.01); C08F 2/00 (2006.01); C08G 61/04 (2006.01); C01B 15/16 (2006.01); C01G 3/00 (2006.01); C01G 55/00 (2006.01); C08L 55/02 (2006.01); C08G 75/0209 (2016.01); C08G 65/38 (2006.01);
U.S. Cl.
CPC ...
C01B 15/16 (2013.01); C01G 3/006 (2013.01); C01G 55/004 (2013.01); C08G 75/0209 (2013.01); C08L 55/02 (2013.01); C01P 2002/30 (2013.01); C01P 2004/38 (2013.01); C08G 65/38 (2013.01); C08L 2205/24 (2013.01);
Abstract

The present invention relates to a composition for forming conductive patterns and a resin structure having a conductive pattern, capable of forming a conductive micropattern on various polymer resin products or resin layers using a simplified process and exhibiting excellent heat dissipation characteristics. The composition for forming conductive patterns comprises: a polymer resin; a non-conductive metal compound represented by a specific chemical formula; and a heat-dissipating material, wherein a metal nucleus is formed from the non-conductive metal compound by the irradiation of electromagnetic waves.


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