The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2018
Filed:
Jul. 01, 2016
Autonetworks Technologies, Ltd., Yokkaichi, Mie, JP;
Sumitomo Wiring Systems, Ltd., Yokkaichi, Mie, JP;
Sumitomo Electric Industries, Ltd., Osaka-shi, Osaka, JP;
Toshiya Hirooka, Mie, JP;
Kouji Fukumoto, Mie, JP;
Daisuke Hashimoto, Mie, JP;
Jisung Kim, Mie, JP;
Kenji Miyamoto, Mie, JP;
Mitsuru Hirose, Mie, JP;
Hitoshi Horio, Mie, JP;
AutoNetworks Technologies, Ltd., Yokkaichi, Mie, JP;
Sumitomo Wiring Systems, Ltd., Yokkaichi, Mie, JP;
SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka-shi, Osaka, JP;
Abstract
When forming molded resin on a terminal-equipped conductive wire, cases where resin inside the mold for insert-molding leaks out from the mold are suppressed. A smooth portion having a smooth outer circumferential surface is formed in a conductive wire of a terminal-equipped conductive wire (smooth portion formation step (S)). Furthermore, a molded resin member that covers the terminal connection portion is formed in a state where the terminal connection portion provided is inserted into an insert-molding mold, and a portion of the conductive wire that extends from a metal terminal is exposed to the outside through an opening portion of the mold (insert-molding step (S)). The outer shape of the smooth portion is a shape that corresponds to the opening shape of the opening portion of the mold. In the insert-molding step (S), the interior of the mold is filled with a resin in a state where the inner circumferential surface of the opening portion of the mold is in contact with the outer circumferential surface of the smooth portion.