The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 28, 2018

Filed:

Jan. 17, 2017
Applicant:

Caterpillar Inc., Peoria, IL (US);

Inventors:

Jason Friedlund, Metamora, IL (US);

Paul Thomas Schmidt, Washington, IL (US);

Vincent Arguelles, Dunlap, IL (US);

Saravanan Desigan, Perambalur, TN (US);

Edo Duheric, Peoria, IL (US);

Todd Nakanishi, Brimfield, IL (US);

Assignee:

Caterpillar Inc., Deerfield, IL (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02P 1/54 (2006.01); H02P 5/00 (2016.01); H02P 5/46 (2006.01); H05K 7/02 (2006.01); H02P 5/74 (2006.01); H02M 7/00 (2006.01); H05K 7/20 (2006.01); H05K 13/00 (2006.01); H02M 1/00 (2006.01);
U.S. Cl.
CPC ...
H05K 7/026 (2013.01); H02M 7/003 (2013.01); H02P 5/74 (2013.01); H05K 7/2039 (2013.01); H05K 13/0023 (2013.01); H02M 2001/008 (2013.01);
Abstract

A power inverter assembly provides a balanced power flow to each of a plurality of electrical machines. The power inverter assembly includes at least one heat sink having a top side and a bottom side, a plurality of pairs of power semiconductor modules mounted along the top and bottom sides of a heat sink for thermal exchange with the heat sink, and a plurality of gate driver boards configured to control the supply of DC power to each of the plurality of pairs of power semiconductor modules. A first pair of semiconductor modules is symmetrically arranged relative to second and third pairs such that the arrangement of the first, second, and third pairs of power semiconductor modules forms a geometric pattern with at least one of the second and third pairs at least partially overhanging the first pair.


Find Patent Forward Citations

Loading…