The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 28, 2018

Filed:

Mar. 04, 2016
Applicant:

Delta Electronics, Inc., Taoyuan, TW;

Inventors:

Sheng-Wei Yeh, Taoyuan, TW;

Chiu-Kung Chen, Taoyuan, TW;

Cheng-Chieh Liu, Taoyuan, TW;

Shao-Chang Tu, Taoyuan, TW;

Assignee:

DELTA ELECTRONICS, INC., Taoyuan Hsien, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02K 15/00 (2006.01); B23P 19/00 (2006.01); H05K 13/04 (2006.01); H05K 3/18 (2006.01); H05K 3/10 (2006.01); H05K 3/34 (2006.01); F04D 19/00 (2006.01); F04D 25/06 (2006.01); F04D 29/32 (2006.01); F04D 29/54 (2006.01); F04D 17/16 (2006.01); F04D 29/28 (2006.01); F04D 29/62 (2006.01); B21D 53/78 (2006.01);
U.S. Cl.
CPC ...
H05K 3/182 (2013.01); F04D 17/16 (2013.01); F04D 19/002 (2013.01); F04D 25/0693 (2013.01); F04D 29/281 (2013.01); F04D 29/325 (2013.01); F04D 29/541 (2013.01); F04D 29/626 (2013.01); H05K 3/105 (2013.01); H05K 3/341 (2013.01); H05K 2201/0215 (2013.01); H05K 2201/0999 (2013.01); Y10T 29/49147 (2015.01);
Abstract

A manufacturing method of a structure of a thin fan includes providing a plastic material containing a plurality of metal particles and forming a housing from the plastic material. A part surface of the housing is removed, and a layout area and an extended circuit are formed on the housing. One terminal of the extended circuit connects to the layout area. A first signal connecting structure is disposed on the housing. The first signal connecting structure connects to the other terminal of the extended circuit. A metal layer is disposed on the layout area and the extended circuit.


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