The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 28, 2018

Filed:

Oct. 23, 2017
Applicant:

Genesis Photonics Inc., Tainan, TW;

Inventors:

Hao-Chung Lee, Tainan, TW;

Yu-Feng Lin, Tainan, TW;

Meng-Ting Tsai, Tainan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/64 (2010.01); H05K 1/05 (2006.01); H05K 3/34 (2006.01); H05K 1/02 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H05K 1/05 (2013.01); H01L 33/62 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/15311 (2013.01); H05K 1/0203 (2013.01); H05K 3/3436 (2013.01); H05K 2201/10106 (2013.01);
Abstract

A light emitting device includes a light source, a light source carrier and a circuit board. The circuit board is configured to provide power to the light source via the light source carrier. The circuit board includes a metal substrate having an upper surface, the upper surface including a first electrode area, a second electrode area and a heat conduction area; a first metal electrode formed on the first electrode area; a first insulation layer formed between the first metal electrode and the metal substrate; a second metal electrode formed on the second electrode area; a second insulation layer formed between the second metal electrode and the metal substrate; and a solder resist layer covering the upper surface of the metal substrate; wherein the heat conduction area is exposed from the solder resist layer, and the heat conduction area is connected to the light source carrier.


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