The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 28, 2018

Filed:

Jan. 06, 2017
Applicant:

Cyntec Co., Ltd., Hsinchu, TW;

Inventors:

Huei-Ren You, Hsinchu, TW;

Bau-Ru Lu, Changhua County, TW;

Kaipeng Chiang, Hsinchu, TW;

Assignee:

CYNTEC CO., LTD., Hsinchu, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H02J 50/10 (2016.01); H01F 27/24 (2006.01); H01F 27/29 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H01F 17/04 (2006.01); H05K 3/36 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H02J 50/10 (2016.02); H01F 17/04 (2013.01); H01F 27/24 (2013.01); H01F 27/29 (2013.01); H01F 27/292 (2013.01); H05K 1/0203 (2013.01); H05K 1/0262 (2013.01); H05K 1/117 (2013.01); H05K 1/184 (2013.01); H05K 3/366 (2013.01); H01F 2017/048 (2013.01); H05K 1/141 (2013.01); H05K 2201/044 (2013.01); H05K 2201/066 (2013.01); H05K 2201/086 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10545 (2013.01);
Abstract

An electronic module is provided. The electronic module comprises an inductor having a magnetic body with a coil encapsulated in the magnetic body and a substrate having electronic devices thereon, wherein a first electrode is disposed on a top surface of the magnetic body and a second electrode is disposed on a lateral surface of the magnetic body, wherein the top surface of the inductor and the bottom surface of the substrate are configured side by side and electrically connected to each other, wherein a plurality of third electrodes are disposed on a lateral surface of the substrate, for electrically connecting the electronic module to an external circuit board.


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