The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2018
Filed:
Dec. 12, 2016
Fujifilm Corporation, Minato-ku, Tokyo, JP;
Toshihiro Kariya, Kanagawa, JP;
Kensuke Masui, Kanagawa, JP;
Takafumi Nakayama, Kanagawa, JP;
Shuji Kanayama, Kanagawa, JP;
Hiroyuki Takahashi, Kanagawa, JP;
FUJIFILM CORPORATION, Tokyo, JP;
Abstract
An object of the present invention is to provide a composition for forming an organic semiconductor film that makes it possible to obtain an organic semiconductor film having excellent mobility and heat stability, an organic semiconductor element including an organic semiconductor film having excellent mobility and heat stability, and a method for manufacturing the organic semiconductor element. The composition for forming an organic semiconductor film of the present invention contains an organic semiconductor having a condensed polycyclic aromatic group and a polymer, in which the number of rings in the condensed polycyclic aromatic group is equal to or greater than 4, at least two rings in the condensed polycyclic aromatic group contain at least one atom selected from the group consisting of a sulfur atom, a nitrogen atom, a selenium atom, and an oxygen atom, the condensed polycyclic aromatic group contains, as a partial structure, at least any one structure selected from the group consisting of a benzene ring, a naphthalene ring, and a phenanthrene ring, and the polymer has a glass transition temperature of equal to or higher than −100° C. and equal to or less than −30° C. and an elastic recovery of equal to or less than 30%.