The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 28, 2018

Filed:

Jul. 17, 2017
Applicant:

SK Hynix Inc., Gyeonggi-do, KR;

Inventors:

Sung-Lae Oh, Chungcheongbuk-do, KR;

Dong-Hyuk Kim, Seoul, KR;

Soo-Nam Jung, Seoul, KR;

Je-Hyun Choi, Gyeonggi-do, KR;

Assignee:

SK Hynix Inc., Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 8/00 (2006.01); H01L 29/51 (2006.01); H01L 27/115 (2017.01); G11C 5/02 (2006.01); G11C 16/04 (2006.01); H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
H01L 29/517 (2013.01); G11C 5/025 (2013.01); G11C 16/0475 (2013.01); H01L 27/115 (2013.01); H01L 27/12 (2013.01); H01L 29/513 (2013.01); H01L 29/518 (2013.01);
Abstract

A nonvolatile memory device includes bit lines arranged in a first direction over a substrate; a memory cell array disposed between the substrate and the bit lines, and including a plurality of planes which are arranged in a second direction perpendicular to the first direction; page buffer circuits disposed between the substrate and the memory cell array; contact pads disposed between the substrate and the memory cell array, the contact pads being suitable for electrically coupling the bit lines and the page buffer circuits; and routing lines disposed at the same layer as the contact pads, and extending in the second direction, wherein the contact pads are disposed to overlap with at least two lines which are arranged in the second direction, and the routing lines are formed in a bent pattern to pass between the contact pads which are disposed to overlap with different lines.


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