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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10062741 B1

PDFFull Text
Date of Patent:
Aug. 28, 2018

Filed:

Aug. 02, 2013

Method for manufacturing bonded body

Applicant:

Joled Inc., Tokyo, JP;

Inventors:

Hiroko Okumura, Osaka, JP;

Takuya Satoh, Kyoto, JP;

Assignee:

JOLED INC., Tokyo, JP;

Attorney:

Greenblum & Bernstein, P.L.C.

Primary Examiner:

Allen Parker

Assistant Examiner:

Patricia Reddington

Int. Cl.
CPC ...
H01L 27/32 (2006.01); H01L 51/00 (2006.01); H01L 51/56 (2006.01); B32B 38/00 (2006.01); B32B 38/10 (2006.01); H01L 51/52 (2006.01); B32B 37/18 (2006.01);
U.S. Cl.
CPC ...
H01L 27/3251 (2013.01); B32B 38/0008 (2013.01); B32B 38/10 (2013.01); H01L 51/003 (2013.01); H01L 51/0013 (2013.01); H01L 51/0024 (2013.01); H01L 51/5246 (2013.01); H01L 51/56 (2013.01); B32B 37/18 (2013.01); B32B 2038/0076 (2013.01); H01L 27/322 (2013.01); H01L 2227/323 (2013.01);
Abstract

A method of manufacturing joined body including: firstly, putting sheet material in intimate contact with first substrate to cover, with resin layer of sheet material, areas of first substrate including first area, boundary area surrounding first area, and second area located across from first area with respect to boundary area, sheet material being laminate including resin layer and separable layer, resin layer containing uncured sealing resin; secondly, curing sealing resin in part of resin layer covering boundary area; thirdly, removing, along with separable layer, part of resin layer covering second area in one direction from one end towards the other of two ends of second area; and fourthly, joining first substrate and second substrate together by arranging second substrate to face first substrate and curing sealing resin with parts of resin layer covering boundary area and first area located between second substrate and first substrate.

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Okumura, Hiroko. (2018). Method for manufacturing bonded body (U.S. Patent No. 10062741). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10062741

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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