The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2018
Filed:
Jun. 23, 2017
Applicants:
Rong-chang Liang, Cupertino, CA (US);
Chia-teng Hsiao, Taipei, TW;
Shun-pin Yang, Toufen, TW;
Jing-den Chen, Union City, CA (US);
Pi-yang Chuang, Kaohsiung, TW;
Inventors:
Rong-Chang Liang, Cupertino, CA (US);
Chia-Teng Hsiao, Taipei, TW;
Shun-Pin Yang, Toufen, TW;
Jing-Den Chen, Union City, CA (US);
Pi-Yang Chuang, Kaohsiung, TW;
Assignee:
TRILLION SCIENCE, INC., Milpitas, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 33/60 (2010.01); H01L 25/075 (2006.01); H01L 33/62 (2010.01); H01L 33/56 (2010.01); H05B 33/06 (2006.01); H05B 33/22 (2006.01);
U.S. Cl.
CPC ...
H01L 24/29 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 25/0753 (2013.01); H01L 33/56 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H05B 33/06 (2013.01); H05B 33/22 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29082 (2013.01); H01L 2224/29124 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29187 (2013.01); H01L 2224/29387 (2013.01); H01L 2224/29499 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83851 (2013.01); H01L 2924/0542 (2013.01); H01L 2924/0544 (2013.01); H01L 2924/05341 (2013.01); H01L 2924/12041 (2013.01); H01L 2933/0066 (2013.01);
Abstract
An anisotropic conductive film (ACF) is disclosed. In one approach, the ACF includes a non-reflective adhesive layer including a top surface, a plurality of conductive particles included with the non-reflective adhesive layer, and a reflective adhesive layer disposed along the top surface of the non-reflective adhesive layer.