The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 28, 2018

Filed:

Dec. 12, 2016
Applicant:

Toshiba Memory Corporation, Minato-ku, JP;

Inventors:

Takayuki Ito, Yokkaichi, JP;

Yasunori Oshima, Yokkaichi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/788 (2006.01); H01L 29/76 (2006.01); H01L 23/00 (2006.01); H01L 27/11524 (2017.01); H01L 27/11556 (2017.01); H01L 27/11548 (2017.01); H01L 27/1157 (2017.01); H01L 27/11582 (2017.01); H01L 27/11575 (2017.01); H01L 29/161 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 27/1157 (2013.01); H01L 27/11524 (2013.01); H01L 27/11548 (2013.01); H01L 27/11556 (2013.01); H01L 27/11575 (2013.01); H01L 27/11582 (2013.01); H01L 29/161 (2013.01);
Abstract

According to one embodiment, the recess has a side surface and a bottom surface. The side surface is continuous with the major surface. The bottom surface is positioned lower than the major surface. The stacked body is provided above the major surface of the substrate. The stacked body includes a plurality of electrode layers stacked with an insulating body interposed. The columnar portion includes a semiconductor body and a stacked film. The semiconductor body extends in a stacking direction of the stacked body through the stacked body. The semiconductor body contacts the side surface and the bottom surface of the recess of the substrate. The stacked film includes a charge storage portion and is provided between the semiconductor body and the stacked body higher than the major surface of the substrate. The stacked film is not provided in the recess of the substrate.


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